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ELF Mission Statement

“To develop a partnership that will enable ELF, Inc. to provide the latest technological services and custom made solutions for the electronic manufacturing needs of every customer “

In our effort to provide our customers with complete contract manufacturing services,
ELF, Inc. now proudly offers

Printed Circuit Board Fabrication

  • 2-3 Week lead-time for production orders
  • Substantial savings from that of domestic PCB fabrication
  • Quick turn prototype, pre-production and production orders
  • All boards 100% inspected and tested for optimum deliverable quality
  • State of the art manufacturing facility

Manufacturing Process

 
  1. Laminating
  2. Inner Layer Imaging
  3. Inner Layer Etching
  4. Inspection (Automated Optical and Visual)
  5. Brown Oxide
  6. Lay- up
  7. Press (Hot & Cold)
  8. Trim
  9. Inspection (Dimensional and Surface)
  10. CNC Drilling

Impedance Controlled Board

Recent advances in high-speed integrated circuit (IC) technology have increased switching time of semiconductors. This PCB is introduced to operate at faster frequencies. This PCB is required to avoid breakdown, delay circuit and energy loss, which is required to increase layer number.

Specification [unit :mm ]

  • Layer 18 –24
  • Base material FR-4
  • Thickness 4.8 -6.5
  • Conductor width 0.15
  • Conductor space 0.15
  • Hole diameter ø0.5
  • Surface Treatment Electroless gold plating

Application: High-speed signal process unit for beam communication, super high frequency communication equipment( radar, microwave links, satellite telecommunication equipment) and navigation equipment.

Burn In Board

This is called DUT(device under testing) which is adhered with many sockets to test large volumes of semiconductor devices. This board checks for defects under high temperature settings by attaching the device to the board in a chamber, where it has a constant temperature over 125° C.

Specification [unit :mm ]

  • Layer 4-8
  • Base material polyimide, FR-5
  • Thickness 1.6
  • Conductor width 0.2
  • Conductor space 0.2
  • Hole diameter ø0.5

Surface Treatment Electroless gold plating

Application: To perform burn in test on semiconductor products.

Ultra Thin Board

Due to increased demand in the electronics industry small and light weight, IC’s, LSC’s and others are becoming more and more compact in size. PCB’s have been required thinner and more precise.

Specification [unit :mm ]

  • Layer 4-8
  • Base material FR-4
  • Thickness 0.4-0.8
  • Conductor width 0.1
  • Conductor space 0.1
  • Hole diameter ø 0.2
  • Surface Treatment Electroless gold plating

Application: IC-Card, Camcorder, Memory Modules, Hand Held Phone, and LCD Monitors.

High Density Board

The electronics industry demand for fine line and statement technology is increasing. The PCB is required to have high density and high speed circuitry.

Specification [unit :mm ]

  • Layer 4-22
  • Base material FR-4
  • Thickness 1.0-1.6
  • Conductor width 0.1
  • Conductor space 0.1
  • Hole diameter ø0.25
  • Surface Treatment Electroless gold plating

Application: Notebook PC’s, Communication Transformer, Super Computer and Workstations.

Back Plane

This board combines several layers of circuitry with plated through holes to form a much smaller and denser package. It will also increase the speed of the electronic signals to assist high speed applications.

Specifications [unit :mm ]

  • Layer 4-16
  • Base material FR-4
  • Thickness 3.2
  • Conductor width 0.15
  • Conductor space 0.15
  • Hole diameter ø0.4
  • Surface Treatment Electroless gold plating & HASL

Application: Site Main Board, Communication Transformer TRS, and Super Computer.

Build Up Board

These PCBs are used for electronic appliances where high density wiring and portability are the objective. Via hole PCB can significantly reduce the board surface area.

Specifications [unit :mm ]

  • Layer 4-16
  • Base material FR-4, RCC
  • Thickness 0.6
  • Conductor width 0.1
  • Conductor space 0.1
  • Hole diameter Ø 0.15
  • Surface Treatment Electroless gold plating

Application: Cellular Telecommunication and Circuit Precision Electronic Appliances.

ELF, Inc. commits to providing every customer with three paramount PCB solutions, high quality, rapid delivery and best price

ELF, Inc also offers:

  • Controlled growth through strategic customers
  • Varied and extensive distribution network and manufacturing network
  • Offshore ELF branch facilities for sheet metal,, manual and molded cable design and fabrication.
  • Dedicated transportation. Free pick up and delivery to all local customers
  • Convenient access for customers. Located in Orange County, CA

 

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